Dr. Zhiqiang Wang

Huazhong University of Science and Technology

Topic: Technical Challenges and Exploration of Silicon Carbide (SIC) Power Modules in High Temperature and High Power Density Applications

Time: (Monday), March 25, 2024, 20:15

Venue: 1F Lecture Hall, School of Computer, Electronics and Information

Abstract: Silicon carbide (SiC) power semiconductor modules exhibit comprehensive performance advantages over traditional Si modules, such as higher voltage endurance, lower switching losses, and higher operating junction temperatures. They hold vast potential in high-temperature, high-power applications like multi-electric aircraft and electric vehicles. However, the development of these applications poses increasingly demanding technical challenges for SiC power modules, including tolerance to higher environmental temperatures, reduced size and weight, and enhanced reliability. Addressing these challenges, this report explores advanced packaging and integration technologies for SiC power modules, including high-temperature SiC power module packaging integration, low-inductance SiC power module packaging, and rapid short-circuit protection for SiC power modules.

Speaker Bio: Zhiqiang Wang, male, native of Hengyang, Hunan province, is a professor and doctoral supervisor at Huazhong University of Science and Technology. He serves as deputy director of the National Key Laboratory for Strong Electromagnetic Technology. He leads a National Scientific and Technological Innovation Talent Team and is a recipient of the National Overseas High-level Young Talents Program. He obtained his bachelor's degree from Hunan University in 2007, master's degree from Zhejiang University in 2010, and Ph.D. in electrical engineering from the University of Tennessee, USA in 2015. From 2014 to 2019, he worked at Oak Ridge National Laboratory in the USA, holding positions as assistant researcher, associate researcher, and researcher, concurrently serving as adjunct professor at the University of Tennessee. His research focuses on wide bandgap power semiconductor chip packaging integration and applications. He has led over 10 research projects including XX Key Fund, National Natural Science Foundation of China (General Program), and US Department of Energy Vehicle Technologies Office Key Projects. He has received awards including the IEEE IAS Best Paper Award, IEEE WiPDA Asia Best Paper Award, PCIM Asia Young Engineer Award, IEEE IAS Outstanding Contributions Editor Award, Oak Ridge National Laboratory Significant Research Event Award, and Oak Ridge National Laboratory Individual Outstanding Contribution Commendation. He was also awarded the University of Tennessee Chancellor's Extraordinary Professional Research Prospects Award. He has been consecutively listed in the top 2% of global scientists by Stanford University from 2019 to 2023.

Organizer: School of Computer, Electronics and Information